29 research outputs found

    High-performance magnetic sensorics for printable and flexible electronics

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    High‐performance giant magnetoresistive (GMR) sensorics are realized, which are printed at predefined locations on flexible circuitry. Remarkably, the printed magnetosensors remain fully operational over the complete consumer temperature range and reveal a giant magnetoresistance up to 37% and a sensitivity of 0.93 T−1 at 130 mT. With these specifications, printed magnetoelectronics can be controlled using flexible active electronics for the realization of smart packaging and energy‐efficient switches

    Rolled-up self-assembly of compact magnetic inductors, transformers and resonators

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    Three-dimensional self-assembly of lithographically patterned ultrathin films opens a path to manufacture microelectronic architectures with functionalities and integration schemes not accessible by conventional two-dimensional technologies. Among other microelectronic components, inductances, transformers, antennas and resonators often rely on three-dimensional configurations and interactions with electromagnetic fields requiring exponential fabrication efforts when downscaled to the micrometer range. Here, the controlled self-assembly of functional structures is demonstrated. By rolling-up ultrathin films into cylindrically shaped microelectronic devices we realized electromagnetic resonators, inductive and mutually coupled coils. Electrical performance of these devices is improved purely by transformation of a planar into a cylindrical geometry. This is accompanied by an overall downscaling of the device footprint area by more than 50 times. Application of compact self-assembled microstructures has significant impact on electronics, reducing size, fabrication efforts, and offering a wealth of new features in devices by 3D shaping.Comment: 19 pages, 3 figures, 6 supplementary figure

    Biomimetic microelectronics for regenerative neuronal cuff implants

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    Smart biomimetics, a unique class of devices combining the mechanical adaptivity of soft actuators with the imperceptibility of microelectronics, is introduced. Due to their inherent ability to self‐assemble, biomimetic microelectronics can firmly yet gently attach to an inorganic or biological tissue enabling enclosure of, for example, nervous fibers, or guide the growth of neuronal cells during regeneration

    A new dimension for magnetosensitive e-skins: active matrix integrated micro-origami sensor arrays

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    Magnetic sensors are widely used in our daily life for assessing the position and orientation of objects. Recently, the magnetic sensing modality has been introduced to electronic skins (e-skins), enabling remote perception of moving objects. However, the integration density of magnetic sensors is limited and the vector properties of the magnetic field cannot be fully explored since the sensors can only perceive field components in one or two dimensions. Here, we report an approach to fabricate high-density integrated active matrix magnetic sensor with three-dimensional (3D) magnetic vector field sensing capability. The 3D magnetic sensor is composed of an array of self-assembled micro-origami cubic architectures with biased anisotropic magnetoresistance (AMR) sensors manufactured in a wafer-scale process. Integrating the 3D magnetic sensors into an e-skin with embedded magnetic hairs enables real-time multidirectional tactile perception. We demonstrate a versatile approach for the fabrication of active matrix integrated 3D sensor arrays using micro-origami and pave the way for new electronic devices relying on the autonomous rearrangement of functional elements in space
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